On average, 90% of the 4,096 microhole electrodes were intracellularly coupled to neurons on top and were able to record many ...
A new technical paper titled “Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based ...
Cycle Emissions of AI Hardware: A Cradle-To-Grave Approach and Generational Trends” was published by researchers at Google.
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
Europe funds power fab; PDF's security acquisition; tariffs; NIST concerns; new ALD tool; Malaysia's advanced packaging fab; ...
Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets ...
The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That ...
To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...
Integrating the next generation of RF, electronic, and photonic components into networking, telecom, and radar systems.
From Stacked Nano-Sheet to Fork-Sheet and CFET Devices” was published by researchers at Imec and Ghent University, et al.
This matches well with AI training, because the performance of LLMs is directly correlated with the number of parameters they ...